Electronics clean down to the nanometre
Cleaning before wire bonding, wettability for soldering and adhesion for component encapsulation.
The surface challenge
At component scale, a thin layer of oxide or organic contamination is enough to compromise a wire bond, a die attach or an encapsulation. Wet methods are sometimes too aggressive or poorly compatible with fragile substrates.
Atmospheric plasma cleans and activates dry, in a targeted and gentle way. It prepares surfaces for the most sensitive assembly steps.
What plasma changes
Cleaning before wire bonding
Remove oxides and contamination for reliable bonds.
Wettability for soldering
Improve solder spreading on difficult surfaces.
Encapsulation adhesion
Prepare surfaces for durable underfill or potting.
Treatment of sensitive substrates
A dry process compatible with fragile components.
Ink guiding and printing
Define wettable and non-wettable zones to precisely guide the deposition of conductive and functional inks in printed electronics.
Frequently treated materials
This list is indicative. The vast majority of polymers, metals, glasses and composites can be treated with DBD plasma. The best way to confirm your case is to send us a description of your part and your objective.
A clean surface, a reliable bond.
48 hours to find out what plasma can do for your surfaces. No commitment, just clear answers from an expert.
Response within 48 hours. No commitment. A technical discussion with an expert.